052-6338 rev c 6 - 2011 absolute maximum ratings symbol parameter ratings unit v ces collector emitter voltage 600 v i c1 continuous collector current @ t c = 25c 87 a i c2 continuous collector current @ t c = 100c 47 i cm pulsed collector current 1 139 v ge gate-emitter voltage 2 30 v p d total power dissipation @ t c = 25c 283 w ssoa switching safe operating area @ t j = 150c 139a @ 600v t j , t stg operating and storage junction temperature range -55 to 150 c t l lead temperature for soldering: 0.063" from case for 10 seconds 300 combi (igbt and diode) typical applications zvs phase shifted and other full bridge half bridge high power pfc boost welding ups, solar, and other inverters high frequency, high ef? ciency industrial features fast switching with low emi very low e off for maximum ef? ciency ultra low c res for improved noise immunity low conduction loss low gate charge increased intrinsic gate resistance for low emi rohs compliant APT47GA60JD40 600v APT47GA60JD40 power mos 8 ? is a high speed punch-through switch-mode igbt. low e off is achieved through leading technology silicon design and lifetime control processes. a reduced e off - v ce(on) tradeoff results in superior ef ? ciency compared to other igbt technologies. low gate charge and a greatly reduced ratio of c res /c ies provide excellent noise immunity, short delay times and simple gate drive. the intrinsic chip gate resistance and capacitance of the poly-silicone gate structure help control di/dt during switching, resulting in low emi, even when switching at high frequency. microsemi website - http://www.microsemi.com high speed pt igbt static characteristics t j = 25c unless otherwise speci? ed symbol parameter test conditions min typ max unit v br(ces) collector-emitter breakdown voltage v ge = 0v, i c = 1.0ma 600 v v ce(on) collector-emitter on voltage v ge = 1 5 v, i c = 47a t j = 25c 2.0 2.5 t j = 125c 1.9 v ge(th) gate emitter threshold voltage v ge =v ce , i c = 1ma 3 4.5 6 i ces zero gate voltage collector current v ce = 600v, v ge = 0v t j = 25c 275 a t j = 125c 3000 i ges gate-emitter leakage current v gs = 30v 100 na s o t -2 2 7 is ot op ? file # e145592 "ul recognized" g e e c downloaded from: http:///
052-6338 rev c 6 - 2011 thermal and mechanical characteristics dynamic characteristics t j = 25c unless otherwise speci? ed APT47GA60JD40 symbol characteristic min typ max unit r jc junction to case thermal resistance (igbt) - - .44 c/w r jc junction to case thermal resistance (diode) 1.21 w t package weight - 29.2 - g v isolation rms voltage (50-60hz sinusoidal waveform from terminals to mounting base for 1 min.) 2500 inlbf symbol parameter test conditions min typ max unit c ies input capacitance capacitance v ge = 0v, v ce = 25v f = 1mhz 6320 pf c oes output capacitance 580 c res reverse transfer capacitance 63 q g total gate charge 3 gate charge v ge = 15v v ce = 300v i c = 47a 226 nc q ge gate-emitter charge 46 q gc gate- collector charge 78 ssoa switching safe operating area t j = 150c, r g = 4.7 4 , v ge = 15v, l= 100uh, v ce = 600v 139 a t d(on) turn-on delay time inductive switching (25c) v cc = 400v v ge = 15v i c = 47a r g = 4.7 4 t j = +25c 24 ns t r current rise time 26 t d(off) turn-off delay time 158 t f current fall time 56 e on2 turn-on switching energy 1119 j e off turn-off switching energy 6 693 t d(on) turn-on delay time inductive switching (125c) v cc = 400v v ge = 15v i c = 47a r g = 4.7 4 t j = +125c 23 ns t r current rise time 28 t d(off) turn-off delay time 190 t f current fall time 109 e on2 turn-on switching energy 1984 j e off turn-off switching energy 6 1037 1 repetitive rating: pulse width and case temperature limited by maximum junction temperature. 2 pulse test: pulse width < 380 s , duty cycle < 2%. 3 see mil-std-750 method 3471.4 r g is external gate resistance, not including internal gate resistance or gate driver impedance. (mic4452) 5 e on2 is the clamped inductive turn on energy that includes a commutating diode reverse recovery current in the igbt turn on energy loss. a combi device is used for the clamping diode.6 e off is the clamped inductive turn-off energy measured in accordance with jedec standard jesd24-1. microsemi reserves the right to change, without notice, the speci? cations and information contained herein. downloaded from: http:///
052-6338 rev c 6 - 2011 typical performance curves APT47GA60JD40 0 20 40 60 80 100 120 25 50 75 100 125 150 0 1 2 3 4 5 0 25 50 75 100 125 150 0 5 10 15 20 0 50 100 150 200 250 0 1 2 3 4 6 8 10 12 14 16 0 20 40 60 80 100 0 2 4 6 8 10 12 14 16 0 50 100 150 200 250 300 350 0 4 8 12 16 20 24 28 32 0 25 50 75 100 125 150 0 1 2 3 4 5 6 250 s pulse test<0.5 % duty cycle t j = 25c. 250 s pulse test <0.5 % duty cycle v ge = 15v. 250 s pulse test <0.5 % duty cycle i c = 23.5a i c = 47a i c = 94a i c = 47a i c = 94a 13v 5v 15v i c = 47a t j = 25c v ce = 480v v ce = 300v v ce = 120v t j = 25c t j = -55c v ge = 15v t j = 55c t j = 150c v ce , collector-to-emitter voltage (v) figure 1, output characteristics (t j = 25c) i c , collector current (a) t j = 25c t j = 125c v ce , collector-to-emitter voltage (v) figure 2, output characteristics (t j = 25c) i c , collector current (a) t j = 125c v ge , gate-to-emitter voltage (v) figure 3, transfer characteristics i c , collector current (a) v ge , gate-to-emitter voltage (v) figure 5, on state voltage vs gate-to-emitter voltage v ce , collector-to-emitter voltage (v) gate charge (nc) figure 4, gate charge v ge , gate-to-emitter voltage (v) t j , junction temperature (c) figure 6, on state voltage vs junction temperature v ce , collector-to-emitter voltage (v) t c , case temperature (c) figure 8, dc collector current vs case temperature i c , dc collector current (a) -50 -25 0 25 50 75 100 125 150 1.15 1.10 1.05 1.00 0.95 0.90 0.85 0.80 0.75 0.70 t j , junction temperature figure 7, threshold voltage vs junction temperature v gs(th) , threshold voltage (normalized) 6v 7v 8v i c = 23.5a 9v 10v downloaded from: http:///
052-6338 rev c 6 - 2011 0 1000 2000 3000 4000 5000 0 25 50 75 100 125 0 3000 6000 9000 12000 15000 0 10 20 30 40 50 0 500 1000 1500 2000 2500 3000 3500 4000 0 20 40 60 80 100 0 1000 2000 3000 4000 5000 0 20 40 60 80 100 0 20 40 60 80 100 120 140 0 20 40 60 80 100 0 20 40 60 80 100 0 20 40 60 80 100 100 125 150 175 200 0 20 40 60 80 100 0 10 20 30 40 50 0 20 40 60 80 100 v ge =15v,t j =125c v ge =15v,t j =25c v ce = 400v r g = 4.7 l = 100 h v ce = 400v v ge = +15v r g = 4.7 v ce = 400v t j = 25c , or 125c r g = 4.7 l = 100 h v ge = 15v v ce = 400v v ge = +15v r g = 4.7 v ce = 400v v ge = +15v r g = 4.7 r g = 4.7 , l = 100 h, v ce = 400v t j = 125c t j = 25c t j = 125c t j = 25c r g = 4.7 , l = 100 h, v ce = 400v t j = 25 or 125c,v ge = 15v t j = 125c, v ge = 15v t j = 25c, v ge = 15v e on2, 94a e off, 47a e on2, 47a e off, 23.5a e on2, 23.5a v ce = 400v v ge = +15v t j = 125c e on2, 94a e off, 47a e on2, 94a e off, 47a e on2, 23.5a e off, 23.5a i ce , collector-to-emitter current (a) figure 9, turn-on delay time vs collector current t d(on) , turn-on delay time (ns) i ce , collector-to-emitter current (a) figure 10, turn-off delay time vs collector current t d(off) , turn-off delay time (ns) i ce , collector-to-emitter current (a) figure 11, current rise time vs collector current t r , rise time (ns) i ce , collector-to-emitter current (a) figure 12, current fall time vs collector current t r , fall time (ns) i ce , collector-to-emitter current (a) figure 13, turn-on energy loss vs collector current e on2 , turn on energy loss ( j) i ce , collector-to-emitter current (a) figure 14, turn-off energy loss vs collector current e off , turn off energy loss ( j) r g , gate resistance (ohms) figure 15, switching energy losses vs gate resistance switching energy losses ( j) t j , junction temperature (c) figure 16, switching energy losses vs junction temperature switching energy losses ( j) e on2, 94a typical performance curves APT47GA60JD40 downloaded from: http:///
052-6338 rev c 6 - 2011 typical performance curves APT47GA60JD40 0 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 10 -5 10 -4 10 -3 10 -2 0.1 1 10 0 100 200 300 400 500 600 10 100 1,000 10,000 z jc , thermal impedance (c/w) 0.3 d = 0.9 0.7 single pulse rectangular pulse duration (seconds) figure 19, maximum effective transient thermal impedance, junction-to-case vs pulse duration 0.5 0.1 0.05 c oes c res c ies peak t j = p dm x z jc +t c duty factor d = t 1 / t 2 t 2 t 1 p dm note: v ce , collector-to-emitter voltage (volts) figure 17, capacitance vs collector-to-emitter voltage c, capacitance (pf) 0.1 1 10 100 800 1 10 100 1000 v ce , collector-to-emitter voltage figure 18, minimum switching safe operating area i c , collector current (a) downloaded from: http:///
052-6338 rev c 6 - 2011 figure 20, turn-on switching waveforms and de? nitions t j = 125c collector current collector voltage gate voltage 5% 10% t d(on) 90% 10% t r 5% switching energy figure 21, turn-off switching waveforms and de? nitions t j = 125c collector voltage collector current gate voltage switching energy 0 t d(off) 10% t f 90% i c a d.u.t. v ce v cc apt30dq60 figure 19, inductive switching test circuit APT47GA60JD40 downloaded from: http:///
052-6338 rev c 6 - 2011 static electrical characteristics dynamic characteristics maximum ratings all ratings: t c = 25c unless otherwise speci ? ed. ultrafast soft recovery rectifier diode symbol characteristic / test conditions APT47GA60JD40 unit i f(av) maximum average forward current (t c = 100c, duty cycle = 0.5) 30 amps i f(rms) rms forward current (square wave, 50% duty) 42 i fsm non-repetitive forward surge current (t j = 45c, 8.3 ms) 320 symbol characteristic / test conditions min type max unit v f forward voltage i f = 30a 1.8 volts i f = 60a 2.0 i f = 30a, t j = 125c 1.3 symbol characteristic test conditions min typ max unit t rr reverse recovery time i f = 1a, di f /dt = -100a/ s , v r = 30v, t j = 25 c - 21 - ns t rr reverse recovery time i f = 30a, di f /dt = -200a/ s v r = 400v, t c = 25 c - 105 - q rr reverse recovery charge - 115 - nc i rrm maximum reverse recovery current - 3 - amps t rr reverse recovery time i f = 30a, di f /dt = -200a/ s v r = 400v, t c = 125 c - 125 -n s q rr reverse recovery charge - 465 - nc i rrm maximum reverse recovery current - 7 - amps t rr reverse recovery time i f = 30a, di f /dt = -1000a/ s v r = 400v, t c = 125 c - 60 - ns q rr reverse recovery charge - 830 -n c i rrm maximum reverse recovery current - 23 - amps z jc , thermal impedance (c/w) 10 -5 10 -4 10 -3 10 -2 10 -1 1.0 rectangular pulse duration (seconds) figure 22, maximum effective transient thermal impedance, junction-to-case vs. pulse duration 1.401.20 1.00 0.80 0.60 0.40 0.20 0 0.5 single pulse 0.1 0.3 0.7 0.05 peak t j = p dm x z jc + t c duty factor d = t 1 / t 2 t 2 t 1 p dm note: d = 0.9 downloaded from: http:///
052-6338 rev c 6 - 2011 dynamic characteristics t j = 25c unless otherwise speci? ed APT47GA60JD40 t j = 125 c v r = 400v 15a 30a 60a 200150 100 50 0 3530 25 20 15 10 50 duty cycle = 0.5 t j = 175 c 5045 40 35 30 25 20 15 10 50 1.21.0 0.8 0.6 0.4 0.2 0.0 200150 100 50 0 c j , junction capacitance k f , dynamic parameters (pf) (normalized to 1000a/ s) i f(av) (a) 140120 100 8060 40 20 0 14001200 1000 800600 400 200 0 q rr , reverse recovery charge i f , forward current (nc) (a) i rrm , reverse recovery current t rr , reverse recovery time (a) (ns) t j = 175 c t j = -55 c t j = 25 c t j = 125 c 0 0.5 1.0 1.5 2.0 2.5 3.0 0 200 400 600 800 1000 1200 1400 1600 0 200 400 600 800 1000 1200 1400 1600 0 200 400 600 800 1000 1200 1400 1600 t j = 125 c v r = 400v 60a 15a 30a t j = 125 c v r = 400v 60a 30a 15a t rr q rr q rr t rr i rrm 0 25 50 75 100 125 150 25 50 75 100 125 150 175 1 10 100 200 v f , anode-to-cathode voltage (v) -di f /dt, current rate of change(a/ s) figure 23. forward current vs. forward voltage figure 24. reverse recovery time vs. current rate of change -di f /dt, current rate of change (a/ s) -di f /dt, current rate of change (a/ s) figure 25. reverse recovery charge vs. current rate of change figure 26. reverse recovery current vs. current rate of change t j , junction temperature ( c) case temperature ( c) figure 27. dynamic parameters vs. junction temperature figure 28. maximum average forward current vs. casetemperature v r , reverse voltage (v) figure 29. junction capacitance vs. reverse voltage downloaded from: http:///
052-6338 rev c 6 - 2011 dynamic characteristics t j = 25c unless otherwise speci? ed APT47GA60JD40 sot-227 (isotop ? ) package outline 31.5 (1.240)31.7 (1.248) 7.8 (.307)8.2 (.322) 30.1 (1.185)30.3 (1.193) 38.0 (1.496)38.2 (1.504) 14.9 (.587)15.1 (.594) 11.8 (.463)12.2 (.480) 8.9 (.350)9.6 (.378) hex nut m 4 (4 places ) 0.75 (.030)0.85 (.033) 12.6 (.496)12.8 (.504) 25.2 (0.992)25.4 (1.000) 1.95 (.077)2.14 (.084) * emitter/anode collector/cathode gate * r = 4.0 (.157) (2 places) 4.0 (.157)4.2 (.165) (2 places) w=4.1 (.161)w=4.3 (.169) h=4.8 (.187)h=4.9 (.193) (4 places) 3.3 (.129)3.6 (.143) * emitter/anode emitter/anode terminals ar e shorted internally. current handling capability is equal for either emitter/anode terminal . apt6017lll 4 3 1 2 5 zer o 0.25 i rrm pearson 2878 current transformer di f /dt adjus t 30 h d.u.t. +18v 0v v r t rr / q rr wavefor m i f - forward conduction current di f /dt - rate of diode current change through zero crossing. i rrm - maximum reverse recovery current t rr - reverse recovery time measured from zero crossing where diode current goes from positive to negative, to the point at which the straight line through i rrm and 0.25, i rrm passes through zero. q rr - area under the curve de ? ned by i rrm and t rr. figure 30. diode test circuit figure 31. diode reverse recovery waveform de? nition 5 1 2 3 4 dimensions in millimeters and (inches) downloaded from: http:///
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